Wafer Thickness Measuring Machine

A Wafer Thickness Measuring Machine is a precision semiconductor metrology system engineered to characterize the thickness and geometric integrity of silicon and compound semiconductor wafers (typically 4″–12″) at sub-micron resolution. Unlike a conventional single-purpose thickness gauge — or a vision measuring machine limited to 2D/3D dimensional inspection — a next-generation platform such as the W350C fuses two measurement systems on one granite-isolated, FEA-optimized frame: a dual-laser spectral confocal displacement system (36 mm working distance, 0.46 μm linearity, grating-encoder-synchronized scanning) that maps Thickness, TTV (Total Thickness Variation), Bow, and Warp across the full wafer surface; and a high-magnification optical vision system that performs planar GD&T measurement — points, lines, circles, arcs, curves, angles, distances, position, symmetry, concentricity, parallelism, and flatness. Multi-sensor auto-switching (vision, contact probe, point/line/area laser) within a single measurement program means one machine delivers both sub-micron thickness metrology and full dimensional inspection — cutting fixture changes, cycle time, and equipment count for wafer fabs, substrate suppliers, and compound semiconductor manufacturers.

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C-Series Wafer Thickness Measuring Machine

The C-series wafer thickness measuring machine adopts a measuring method with two opposite point spectral confocal displacement sensors (top and bottom). It is mainly used for measuring the thickness and flatness of wafers. Integrated with 2D vision measurement, it can detect 2D dimensions on wafer surfaces. Additionally, it is applicable to the thickness and flatness measurement of transparent/non-transparent films, sheet materials, and multi-layer transparent materials.

Product Features

Adopts point spectral confocal displacement sensors to achieve micron and sub-micron measurement accuracy;
Supports single-sided measurement and dual-sided opposite measurement. The opposite measurement mode completely eliminates errors caused by uneven bottom surfaces of workpieces;
Integrated visual imaging function to measure 2D surface dimensions of workpieces;
Supports single-point measurement at arbitrary positions and array scanning measurement with unlimited sampling points;
Adopts platform moving structure to ensure the thickness measurement accuracy of opposite spectral confocal sensors is not affected by platform displacement.

Software Features

Intuitive and user-friendly interface; one-click access to frequently used functions including measurement programming and operation control;
Supports the combined application of multiple sensors, including contact star probes, 3D line-scan lasers, point spectral confocal displacement sensors and line spectral confocal displacement sensors;
Built-in auto-focus, auto edge-finding and auto lighting adjustment functions. Combined with platform motion control, it realizes high-volume rapid measurement for products with identical specifications;
Supports auxiliary functions such as fast measurement via CAD file import, automatic code scanning and map navigation;
Enables measurement report export in multiple formats including Excel, PDF, Word and TXT, with a wide selection of configurable parameters;
Equipped with a comprehensive temperature compensation system, supporting two compensation modes: Temperature Mode and Proportion Mode, enabling rapid accuracy correction for diverse application scenarios.

W350C Wafer Thickness Measuring System	Item	Specification
Overall Dimensions	Instrument dimensions L×W×H (mm)	1430 × 740 × 1550
Overall Dimensions	Net weight (kg)	900
Travel	Point Spectral Confocal Displacement Sensor: X / Y / Z (mm)	X: 350 Y: 350 Z: 100
Travel	Imaging: X / Y / Z (mm)	X: 250 Y: 350 Z: 100
Measurement Accuracy	Point Spectral Confocal Sensor: static linearity accuracy (μm)	±0.46
	Point Spectral Confocal Sensor: thickness measurement accuracy (μm)	±2
	Point Spectral Confocal Sensor: E UZ, MPE (μm)	±(3.0 + L/200)
	Imaging: E UXY, MPE (μm)	±(2.5 + L/200)
L = length of the measured object, in mm.
Motion Performance	X/Y-axis speed (mm/s)	200
Motion Performance	Z-axis speed (mm/s)	150
Imaging System	Camera type	HD industrial digital camera
Imaging System	Resolution	2 megapixels
Optical System	Lens type	Continuous auto-zoom lens
	Optical magnification range	0.7X – 4.5X
	Image (display) magnification range	18X – 230X
	Lens working distance (mm)	90 ± 2
Magnification values are approximate; actual values depend on monitor size and resolution.
Illumination System	Surface light	LED cold light source, programmable brightness level
	Contour light	LED cold light source, programmable brightness level
	Coaxial light	LED cold light source, programmable brightness level
Encoder System	High-precision linear glass scale (μm)	0.1
Point Spectral Confocal Displacement Sensor	Working distance	36 mm
	Effective range	±1.15 mm
	Static linearity accuracy	±0.46 μm
	Dual-head opposed / single-head transmission thickness accuracy	±2 μm
	Measurement modes	Displacement mode: flatness, warpage, height difference, etc. Thickness mode: direct-penetration thickness measurement of transparent materials Opposed mode: dual-sensor opposed thickness measurement
Motion Joystick	High-performance configuration	LCD display for real-time monitoring of machine status; one-touch emergency-stop button for safe operation; speed-adjustment knob for flexible motion control
Industrial Computer	High-performance configuration	Intel i7 processor • 16GB DDR4 RAM • 1024GB SSD • 27″ HD LCD monitor • Windows 10 OS
Worktable Load	Load capacity (kg)	5
Power Requirements	Voltage	AC 200–240V, 50/60Hz
	Power consumption	≥1500W
	Grounding	Mandatory; ground resistance ≤ 4Ω
Operating Environment	Temperature range	20 ± 2℃
	Temperature gradient	0.5℃/h, 2℃/24h
	Relative humidity	30%–80%
	Vibration level	< 0.002g, below 15Hz, away from vibration sources

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