C-Series Wafer Thickness Measuring Machine

Product Features

• Adopts point spectral confocal displacement sensors to achieve micron and sub-micron measurement accuracy;
• Supports single-sided measurement and dual-sided opposite measurement. The opposite measurement mode completely eliminates errors caused by uneven bottom surfaces of workpieces;
• Integrated visual imaging function to measure 2D surface dimensions of workpieces;
• Supports single-point measurement at arbitrary positions and array scanning measurement with unlimited sampling points;
• Adopts platform moving structure to ensure the thickness measurement accuracy of opposite spectral confocal sensors is not affected by platform displacement.

Software Features

• Intuitive and user-friendly interface; one-click access to frequently used functions including measurement programming and operation control;
• Supports the combined application of multiple sensors, including contact star probes, 3D line-scan lasers, point spectral confocal displacement sensors and line spectral confocal displacement sensors;
• Built-in auto-focus, auto edge-finding and auto lighting adjustment functions. Combined with platform motion control, it realizes high-volume rapid measurement for products with identical specifications;
• Supports auxiliary functions such as fast measurement via CAD file import, automatic code scanning and map navigation;
• Enables measurement report export in multiple formats including Excel, PDF, Word and TXT, with a wide selection of configurable parameters;
• Equipped with a comprehensive temperature compensation system, supporting two compensation modes: Temperature Mode and Proportion Mode, enabling rapid accuracy correction for diverse application scenarios.

Model Specification