- Overcoming micron-level dimensional & defect challenges. Safeguarding display uniformity through high-speed, non-contact, intelligent optical inspection.
- Core Feature Badges:
±0.5 µm Indication Error20 MP Industrial SensorUp to 100X Optical Magnification
Industry Pain Points & Value Proposition
- Breaking Through Precision & Yield Bottlenecks in Panel Manufacturing
- Pain Points:
- Sub-micron Scale Challenges: Microscopic pixel patterns and electrode traces require rigorous control over linewidth, pitch, and profile morphology.
- Sub-Micron Alignment Tolerance: Multi-layer architectures (Glass Substrates / Color Filters / LC Layers) mandate alignment accuracy within ±1 µm.
- Defect Sensitivity & Yield Drag: Subtle micro-deviations cause severe visual artifacts. Conventional inspection methods suffer from slow throughput and high operational costs.
- Value Proposition:
- Powered by Navinertia Tech advanced video metrology, we eliminate critical bottlenecks in dimensional verification, defect detection, and optical characterization—maximizing production yield while driving down costs.
Key Inspection Capabilities
- Comprehensive Coverage for Critical Process Inspection
- Inspection Modules (3-Column Grid):
- Bonding Particle Metrology & Counting: High-precision automated observation and statistical particle counting for TFT, OLED, TP, COF, and COG bonding interfaces.
- High-Resolution Defect Inspection: Real-time, high-contrast visualization of RGB sub-pixel anomalies, micro-cracks, and bonding indentations.
- Critical Dimension (CD) Metrology: Micron/sub-micron line-width measurement, pitch verification, and 2D/3D profile morphology analysis.
Technical Specifications & Core Advantages
- Navinertia Tech Video Measuring System — The Dedicated Optical Inspection Engine
- Key Specs (Highlight Cards):
- 20 MP Ultra-HD Industrial Camera
- 100X High-Magnification Zoom Optical System
- ±0.5 µm Measurement Indication Error (under 50X Objective)
- Feature Breakdown:
- Substrate Versatility: High-NA objectives deliver optimal contrast across challenging materials, including ultra-thin glass, transparent ITO, and reflective metallic circuitry.
- Automated CNC Intelligence: Programmable CNC routines support automated inspection paths for batch inspection and rapid throughput.
- DIC Module Integration (Optional): Differential Interference Contrast (DIC) imaging option enhances nanoscale surface relief and low-contrast edge definition.
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Metrology Hardware & Sub-Pixel Visual Inspection
RGB Micro-array alignment, ACF particle count & Indentation marks mapping
Applicable Substrates & Modules
- TFT-LCD
- Flexible OLED
- Touch Panel (TP)
- COF / COG Bonding
- NDA-protected inquiries
- Metrology whitepaper PDF delivered instantly
Engineering Statement
Engineered for high-speed, non-contact metrology across TFT, OLED, Touch Panel, COF, and COG manufacturing lines.
