W350C Silicon Wafer Thickness Vision Measuring Machine

W350C Silicon Wafer Thickness Vision Measuring Machine

You can know how thick is a silicon wafer is by W350C Wafer Thickness Gauge, developed by Navinertia Tech, is a fully automatic, high-accuracy measurement system designed for semiconductor wafer inspection and precision planar geometry analysis. It combines a dual-head spectroscopic chromatic confocal sensor system​ with a high-resolution vision module, making it ideal for thickness, TTV (Total Thickness Variation), Bow, and Warp measurement of 4″, 6″, 8″, and 12″ wafers, as well as general 2D/3D geometric dimensioning and tolerancing (GD&T).

W-Series Horizontal Vision Measuring Machine

The W-series horizontal vision measuring machine integrates a high-precision optical system and intelligent image processing software. It enables non-contact measurement of workpieces such as shafts, bars, lead screws, cutting tools, optical fibers and optical rods. Equipped with fully automatic CNC programming measurement function, the machine can accurately obtain geometric dimensions, geometric tolerances and surface profile data of workpieces. It is widely applicable to scenarios including precision machining and CNC tool inspection.

Product Features

  • Horizontally arranged optical axis allows horizontal placement of workpieces, providing ample loading space;
  • One or two sets of imaging systems are optionally available to balance wide and narrow fields of view, covering diverse application scenarios;
  • Integrated all-in-one design saves installation space and overall application costs;
  • Optional dedicated wide-field telecentric lens for instant measuring machines, enabling conversion into a horizontal flash measuring machine.

Software Features

  • Intuitive and user-friendly interface; one-click access to frequently used functions including measurement programming and operation control;
  • Supports the combined application of multiple sensors, including contact star probes, 3D line-scan lasers, point spectral confocal displacement sensors and line spectral confocal displacement sensors;
  • Built-in auto-focus, auto edge-finding and auto lighting adjustment functions. Combined with platform motion control, it realizes high-volume rapid measurement for products with identical specifications;
  • Supports auxiliary functions such as fast measurement via CAD file import, automatic code scanning and map navigation;
  • Enables measurement report export in multiple formats including Excel, PDF, Word and TXT, with a wide selection of configurable parameters;
  • Equipped with a comprehensive temperature compensation system, supporting two compensation modes: Temperature Mode and Proportion Mode, enabling rapid accuracy correction for diverse application scenarios.

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