L-Series Chip Coplanarity Measuring Machine

Product Features

• Combines micron-level high-precision line laser scanning and optical image measurement, achieving higher accuracy than conventional structured light measurement;
• Generates high-resolution 3D point cloud diagrams directly, enabling height extraction at any arbitrary point;
• Supports 2D optical measurement for accurate inspection of solder ball diameter, pin width and pin pitch;
• Powerful software algorithm enables simple and rapid programming with instant measurement output after scanning;
• Compatible with single-piece measurement and batch array measurement for workpieces placed in fixtures or Tray trays;
• Self-developed gantry marble frame structure ensures ultra-high precision and long-term equipment stability;
• Ergonomic all-in-one design ensures convenient and comfortable operation.

Software Features

• Intuitive and user-friendly interface; one-click access to frequently used functions including measurement programming and operation control;
• Supports the combined application of multiple sensors, including contact star probes, 3D line-scan lasers, point spectral confocal displacement sensors and line spectral confocal displacement sensors;
• Built-in auto-focus, auto edge-finding and auto lighting adjustment functions. Combined with platform motion control, it realizes high-volume rapid measurement for products with identical specifications;
• Supports auxiliary functions such as fast measurement via CAD file import, automatic code scanning and map navigation;
• Enables measurement report export in multiple formats including Excel, PDF, Word and TXT, with a wide selection of configurable parameters;
• Equipped with a comprehensive temperature compensation system, supporting two compensation modes: Temperature Mode and Proportion Mode, enabling rapid accuracy correction for diverse application scenarios.

Model Specification