Wafer Thickness Measuring Machine

Wafer Thickness Measuring Machine

Wafer Thickness Measuring Machine (C-Series) is a high-precision, non-contact inspection system based on dual opposite spectral confocal displacement sensors (top and bottom). It is designed for accurate measurement of wafer thickness and flatness in semiconductor and precision manufacturing applications.

Integrated with a 2D vision inspection system, it also enables fast detection of wafer surface dimensions and geometric features. Beyond semiconductor wafers, the system is widely used for thickness and flatness measurement of transparent and non-transparent films, sheets, and multi-layer transparent materials.

Optimized for high-accuracy, high-throughput industrial metrology, the C-Series delivers stable performance for quality control and process monitoring in advanced material production.

C-Series Wafer Thickness Measuring Machine

The C-series wafer thickness measuring machine adopts a measuring method with two opposite point spectral confocal displacement sensors (top and bottom). It is mainly used for measuring the thickness and flatness of wafers. Integrated with 2D vision measurement, it can detect 2D dimensions on wafer surfaces. Additionally, it is applicable to the thickness and flatness measurement of transparent/non-transparent films, sheet materials, and multi-layer transparent materials.

Product Features

  • Adopts point spectral confocal displacement sensors to achieve micron and sub-micron measurement accuracy;
  • Supports single-sided measurement and dual-sided opposite measurement. The opposite measurement mode completely eliminates errors caused by uneven bottom surfaces of workpieces;
  • Integrated visual imaging function to measure 2D surface dimensions of workpieces;
  • Supports single-point measurement at arbitrary positions and array scanning measurement with unlimited sampling points;
  • Adopts platform moving structure to ensure the thickness measurement accuracy of opposite spectral confocal sensors is not affected by platform displacement.

Software Features

  • Intuitive and user-friendly interface; one-click access to frequently used functions including measurement programming and operation control;
  • Supports the combined application of multiple sensors, including contact star probes, 3D line-scan lasers, point spectral confocal displacement sensors and line spectral confocal displacement sensors;
  • Built-in auto-focus, auto edge-finding and auto lighting adjustment functions. Combined with platform motion control, it realizes high-volume rapid measurement for products with identical specifications;
  • Supports auxiliary functions such as fast measurement via CAD file import, automatic code scanning and map navigation;
  • Enables measurement report export in multiple formats including Excel, PDF, Word and TXT, with a wide selection of configurable parameters;
  • Equipped with a comprehensive temperature compensation system, supporting two compensation modes: Temperature Mode and Proportion Mode, enabling rapid accuracy correction for diverse application scenarios.

Model Specification

Parameter Item
W350C
Machine Dimension (L×W×H) (mm)
1100×1000×1800
XY-Axis Point Measuring Range (mm)
350×350
XY-Axis Vision Measuring Range (mm)
250×350
Net Weight (kg)
900

Reviews

There are no reviews yet.

Be the first to review “Wafer Thickness Measuring Machine”

Your email address will not be published. Required fields are marked *

Scroll to Top